What is extra vital is the capability that the corporate achieves with it. It is reported that TSMC achieves 60% of all EUV wafer capability on the planet, which is a large achievement of what TSMC can do with the tools. The firm proper now has solely two nodes on EUV in high-volume manufacturing, the 7 nm+ node and 5 nm node (which goes HVM in This fall), nonetheless, that’s greater than any of its opponents. All of the longer term nodes are to be manufactured utilizing the EUV machines and the smaller nodes require it. As far because the opponents go, solely Samsung is presently making EUV silicon on the 7 nm LPP node. Intel is but to launch some merchandise on a 7 nm node of its personal, which is the primary EUV node from the corporate.