SiPearl to Manufacture its 72-Core Rhea HPC SoC at TSMC

SiPearl has this week introduced their collaboration with Open-Silicon Research, the India-based entity of Open5, to provide the next-generation SoC designed for HPC functions. SiPearl is part of the European Processor Initiative (EPI) crew and is accountable for designing the SoC itself that’s purported to be a base for the European exascale supercomputer. In the partnership with Open-Silicon Research, SiPearl expects to get a service that may combine all of the IP blocks and assist with the tape out of the chip as soon as it’s completed. There is a deadline set for the yr 2023, nonetheless, each corporations anticipate the chip to get shipped by This autumn of 2022.

When it involves particulars of the SoC, it’s referred to as Rhea and it is going to be a 72-core Arm ISA primarily based processor with Neoverse Zeus cores interconnected by a mesh. There are going to be 68 mesh community L3 cache slices in between all the cores. All of that shall be manufactured utilizing TSMC’s 6 nm excessive ultraviolet lithography (EUV) expertise for silicon manufacturing. The Rhea SoC design will make the most of 2.5D packaging with many IP blocks stitched collectively and HBM2E reminiscence current on the die. It is unknown precisely what configuration of HBM2E goes to be current. The system will even see assist for DDR5 reminiscence and thus allow two-level system reminiscence by combining HBM and DDR. We are excited to see how the ultimate product appears to be like like and now we look forward to extra updates on the mission.