‘I-Cube4’ incorporates 4 HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal administration in addition to steady energy provide
Samsung Electronics, a world chief in superior semiconductor expertise, immediately introduced the fast availability of its next-generation 2.5D packaging expertise Interposer-Cube4 (I-Cube4), main the evolution of chip packaging expertise as soon as once more.
Samsung’s I-CubeTM is a heterogeneous integration expertise that horizontally locations a number of logic dies (CPU, GPU, and many others.) and several other High Bandwidth Memory (HBM) dies on prime of a silicon interposer, making a number of dies function as a single chip in a single bundle.
Samsung’s new I-Cube4, which includes 4 HBMs and one logic die, was developed in March because the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and huge information heart functions, I-CubeFour is anticipated to carry one other stage of quick communication and energy effectivity between logic and reminiscence by means of heterogeneous integration.
“With the explosion of high-performance applications, it is essential to provide a total foundry solution with heterogeneous integration technology to improve the overall performance and power efficiency of chips,” mentioned Moonsoo Kang, senior vp of Foundry Market Strategy at Samsung Electronics. “With the mass-production experience amassed through I-Cube2 and the commercial breakthroughs of I-Cube4, Samsung will wholly support customers’ product implementations.”
In basic, the silicon interposer space proportionally will increase to accommodate extra logic dies and HBMs. Since the silicon interposer within the I-Cube is thinner (round 100㎛ thick) than paper, the probabilities of bending or warping a bigger interposer change into greater, which negatively impacts product high quality.
With robust experience and information on semiconductors, Samsung has studied the way to management interposer warpage and thermal growth by means of modifications to materials and thickness, succeeding in commercializing the I-CubeFour resolution.
Additionally, Samsung has developed its personal mold-free construction for I-CubeFour to effectively take away warmth and enhanced its yield by conducting a pre-screening take a look at that may filter out faulty merchandise through the fabrication course of. This method supplies extra advantages corresponding to a discount within the variety of course of steps, which lead to value financial savings and shorter turnaround time.
Since the launch of I-Cube2 in 2018 and eXtended-Cube (X-Cube) in 2020, Samsung’s heterogeneous integration expertise has signaled a brand new period within the high-performance computing market. Samsung is at present creating extra superior packaging applied sciences to I-Cube6 and better through the use of a mix of superior course of nodes, excessive velocity interface IPs and superior 2.5/3D packaging applied sciences, which is able to assist clients design their merchandise in the best approach.
I-Cube4TM (Interposer Cube) Package Structure
