Samsung Electronics and Broadcom in the present day introduced the signing of a memorandum of understanding (MOU) to broaden their strategic collaboration throughout reminiscence and foundry applied sciences, supporting the subsequent era of AI infrastructure.
The MOU was introduced in the course of the AI Summit, held at The Midway in San Francisco. Attendees included Jinman Han, President and Head of Samsung Electronics’ Foundry Business, Hock Tan, President and CEO of Broadcom, senior executives from each firms and representatives of the Korean authorities.
The firms anticipate the collaboration to be estimated at greater than $200 billion throughout reminiscence and foundry over the subsequent 5 years by 2030.
On the reminiscence entrance, Samsung and Broadcom plan to pursue a strategic collaboration for the provision of industry-leading reminiscence options, together with High Bandwidth Memory (HBM), supporting Broadcom’s next-generation AI accelerators.
In foundry, the businesses’ collaboration focuses on Samsung’s 2-nanometer (nm) and under course of applied sciences for Broadcom’s merchandise, together with Wireless Broadband Communications (WBC) options. The collaboration is anticipated to increase to superior packaging applied sciences constructed on Samsung’s 2nm course of, together with 2.3D and a pair of.5D integration, to allow higher-performance and extra power-efficient AI and networking silicon.
“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging,” stated Young Hyun Jun, Vice Chairman & CEO of the Device Solutions (DS) Division at Samsung Electronics. “By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.”
“As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important,” stated Charlie Kawwas, President, Semiconductor Solutions Group of Broadcom. “By combining Samsung’s memory and foundry expertise with Broadcom’s AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure.”
With capabilities encompassing reminiscence, logic, foundry and superior packaging, Samsung is uniquely positioned to ship built-in semiconductor options for the AI period. The expanded collaboration with Broadcom displays Samsung’s continued deal with supporting clients with end-to-end semiconductor applied sciences throughout an more and more various vary of AI and high-performance computing functions.
