Samsung Electronics immediately introduced it has signed a Memorandum of Understanding (MOU) with AMD to increase their strategic collaboration on next-generation AI reminiscence and computing applied sciences.
The signing ceremony was held at Samsung’s most superior chip manufacturing complicated in Pyeongtaek, Korea, attended by Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics.
“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration,” stated Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. “From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD’s evolving AI roadmap.”
“Powering the next generation of AI infrastructure requires deep collaboration across the industry,” stated Dr. Lisa Su, Chair and CEO of AMD. “We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms. Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.”
Under the MOU, Samsung and AMD will align on major HBM4 provide for the next-generation AMD AI accelerator, the AMD Instinct MI455X GPU, in addition to superior DRAM options for sixth Gen AMD EPYC CPUs, codenamed “Venice.” These applied sciences will assist next-generation AI programs combining AMD Instinct GPUs, AMD EPYC CPUs and rack-scale architectures such because the AMD Helios platform.
Samsung and AMD are carefully collaborating on superior reminiscence applied sciences for AI and knowledge middle workloads. As reminiscence bandwidth and energy effectivity change into more and more crucial to system-level efficiency, this collaboration will assist ship extra optimized AI infrastructure for patrons.
An industry-first to enter mass manufacturing, Samsung’s HBM4 is constructed on its most superior Sixth-generation 10-nanometer (nm)-class DRAM course of (1c) and a 4nm logic base die, that includes processing speeds of as much as 13 gigabits-per-second (Gbps) and most 3.Three terabytes-per-second (TB/s) bandwidth that exceeds {industry} requirements.
Powered by Samsung HBM4’s industry-leading efficiency, reliability and vitality effectivity, the AMD Instinct MI455X GPU is anticipated to be the optimum resolution for high-performance programs dealing with AI mannequin coaching and inference.
The MI455X GPU will function a key constructing block for the AMD Helios rack-scale structure, designed to ship the efficiency and scalability required for next-generation AI infrastructure.
As a part of their collaboration, Samsung and AMD may also work collectively on high-performance DDR5 reminiscence optimized for the 6th Gen AMD EPYC CPUs. The corporations goal to ship industry-leading DDR5 reminiscence options for programs constructed on the AMD Helios rack-scale structure.
The two corporations may also talk about alternatives for foundry partnership, by way of which Samsung would supply foundry companies for next-generation AMD merchandise.
Samsung and AMD have collaborated for almost twenty years throughout graphics, cellular and computing applied sciences, together with Samsung serving as the first HBM3E accomplice to AMD, powering the newest AMD Instinct MI350X and MI355X AI accelerators.
