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Micron sampling MRDIMMs for AI and HPC

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Micron sampling MRDIMMs for AI and HPC

Micron MRDIMMs. Credit: Micron

Micron Technology has disclosed that it’s presently conducting sampling of its Multiplexed Rank Dual Inline Memory Modules (MRDIMM) for memory-intensive functions, together with AI and HPC.

Micron prospects will have the ability to function more and more demanding workloads and maximize the worth of their compute infrastructure with the MRDIMMs. Micron MRDIMMs surpass present TSV RDIMMs in functions that necessitate greater than 128GB of reminiscence per DIMM slot by offering the very best bandwidth, largest capability, and lowest latency, in addition to improved efficiency per watt, to expedite memory-intensive virtualized multi-tenant, HPC, and AI information middle workloads.

The new reminiscence providing is the primary technology within the Micron MRDIMM household and will likely be appropriate with Intel Xeon 6 processors, in response to the reminiscence chip vendor.

By implementing DDR5 bodily and electrical requirements, MRDIMM know-how delivers a reminiscence development that permits scaling of each bandwidth and capability per core to future-proof compute techniques and meets the increasing calls for of knowledge middle workloads.

MRDIMMs present the next benefits over RDIMMs: Effective reminiscence bandwidth will increase by as much as 39%; bus effectivity improves by over 15%; and latency enhancements by as much as 40% when in comparison with RDIMMs.

MRDIMMs assist a large capability vary of 32GB to 256GB in normal and tall type elements (TFF), making them preferrred for high-performance 1U and 2U servers. TFF modules’ improved thermal design lowers DRAM temperatures by as much as 20 levels Celsius whereas sustaining the identical energy and airflow, permitting for extra environment friendly cooling in information facilities and optimizing total system activity vitality for memory-intensive workloads.

Micron’s industry-leading reminiscence design and course of know-how utilizing 32Gb DRAM die permits 256GB TFF MRDIMMs to have the identical energy envelope as 128GB TFF MRDIMMs utilizing 16Gb die. A 256GB TFF MRDIMM supplies a 35% enchancment in efficiency over similar-capacity TSV RDIMMs on the most information price. With 256GB TFF MRDIMMs, information facilities can drive unprecedented TCO advantages over TSV RDIMMs.

Micron MRDIMMs can be found now and will likely be delivery in quantity within the second half of calendar 12 months 2024. Following generations of MRDIMMs will proceed to offer as much as 45% extra reminiscence bandwidth per channel than similar-generation RDIMMs.

“By leveraging DDR5 interfaces and know-how, MRDIMMs present seamless compatibility with present Xeon 6 CPU platforms,…



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