Only three days were enough for someone to get ahold of Meizu’s latest Pro 7 Plus flagship smartphone and disassemble it. Thanks to a Chinese site and the teardown, we now know every single component inside the phone and steps how to open the phone just in case something needs to be replaced.
The phone doesn’t require heat gun as you only need to remove two screws from the bottom and use a suction cup and a sliding pick to separate the back cover. Once inside, the rest is pretty much easy to remove. The interesting thing is a use of C-shaped motherboard, which is being used only by Apple and Samsung.
To get ahold of rear display, you need to remove pretty much everything and then use a heat gun to remove it, but be careful as it cracks easily.
The full teardown is available here.
