LeEco and Coolpad continue working together on new smartphones. In the past, Coolpad was considered as a manufacturer of entry-level phones, but LeEco wants to change that and since the acquisition, Coolpad has released several high-end models.
According to latest TENAA listing and benchmark scores, the companies are now preparing a true flagship smartphone under the Cool lineup. The handset is expected to be powered by a high-end Snapdragon 821 chipset and would be the third handset from the companies, after the Cool 1 Dual and the Cool 1C.
Based on TENAA listing, the Cool 1S is said to feature a 5.5-inch HD display, 4 GB or 6 GB of RAM, up to 128 GB, a 4,000 mAh battery, a 16-megapixel rear camera and an 8-megapixel front snapper.
