AMD Updates Roadmaps to Lock RDNA2 and Zen three onto 7nm+, with

AMD up to date its expertise roadmaps to mirror a 2020 launch window for its upcoming CPU and graphics architectures, “Zen 3” and RDNA2. The two can be based mostly on 7 nm+ , which is AMD-speak for the 7 nanometer EUV silicon fabrication course of at TSMC, that guarantees a major 20 p.c improve in transistor-densities, giving AMD excessive transistor budgets and extra clock-speed headroom. The roadmap slides nevertheless trace that in contrast to the “Zen 2” and RDNA simultaneous launch on seventh July 2019, the next-generation launches will not be simultaneous.

The slide for CPU microarchitecture states that the design section of “Zen 3” is full, and that the microarchitecture group has already moved on to develop “Zen 4.” This means AMD is now growing merchandise that implement “Zen 3.” On the opposite hand, RDNA2 remains to be in design section. The crude x-axis on each slides that denotes 12 months of anticipated transport, too seems to recommend that “Zen 3” based mostly merchandise will precede RDNA2 based mostly ones. “Zen 3” can be AMD’s first response to Intel’s “Comet Lake-S” and even “Ice Lake-S,” if the latter involves fruition earlier than Computex 2020. In the run as much as RDNA2, AMD will scale up RDNA a notch bigger with the “Navi 12” silicon to compete with graphics playing cards based mostly on NVIDIA’s “TU104” silicon. “Zen 2” will obtain product stack additions within the type of a brand new 16-core Ryzen 9-series chip later this month, and the third technology Ryzen Threadripper household.