X499 or X299G? Intel’s Fall 2019 HEDT Update Heralds a New

Our readers noticed an attention-grabbing visible element that missed us throughout our protection of GIGABYTE’s three new socket LGA2066 motherboards unveiled at Computex 2019. One of the three boards, the X299S Designare 10G, has the hard-marking “X499” on its CPU VRM heatsink. Another element that strikes us is that not one of the three new boards we pictured has “X299” printed on the PCB wherever. The Designare 10G has a sticker under the printed GIGABYTE emblem that reads “X299G Designare 10G.” The purported X299G Aorus Master has one other attention-grabbing element: proper above the “Aorus Master” print, there is a tiny sticker marked “X299G,” positioned as if it is overlaying up a printed marking on the PCB itself.

All these particulars lead us to marvel if GIGABYTE tried to cowl up that these boards are in truth based mostly on the unannounced X499 Express chipset, and made to seem like they’re X299. We solely have paper stickers and the sales space placards that point out “X299,” whereas a metallic embossing on the Designare 10G’s VRM heatsink reads X499. Intel in its Computex 2019 keynote introduced that it’s going to introduce new Core X HEDT processors. It’s been over 2 years for the reason that first Core X “Skylake-X” processors launched in Q2-2017. Intel refreshed the lineup in 2018 with ninth technology branding and soldered TIM, with a number of specification enhancements throughout the product-stack, however a largely unchanged silicon. It’s probably that the Fall 2019 launch may see new chips with elevated core counts, even perhaps the fabled 22-core die, and a few {hardware} mitigation towards latest safety vulnerabilities.