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Taiwan-based DRAM chipmaker Winbond Electronics will begin volume production of memory chips on a 3x nm process in the fourth quarter of 2016, according to a Chinese-language Commercial Times report, citing company president Tung-yi Chan.
Noting that the company’s product capacity has been fully booked in the fourth quarter of 2016, Chan said that Winbond will complete the installation of manufacturing equipment for its new Fab C at the end of 2016, allowing the fab to enter wafer production in the first quarter of 2017 and begin generating revenues in the third quarter.
Sales of memory products to the automotive and industrial control sectors accounted for 16% of Winbond’s total sales in the second quarter of 2016, and demand from these sectors remains brisk in the fourth quarter, Chan indicated.
Winbond posted revenues of NT$31.317 billion (US$987.58 million) in the first three quarters of 2016, increasing 9.8% from a year earlier.
The company’s stock price edged up NT$0.05 to close at NT$10.05 on the Taiwan Stock Exchange (TSE) during the October 18 session.
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