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Winbond flash chip adopted in MacBook Pro, says report

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Winbond flash chip adopted in MacBook Pro, says report
Jessie Shen, DIGITIMES, Taipei [Thursday 3 November 2016]

Taiwan-based Winbond Electronics has entered the supply chain for Apple’s new MacBook Pro with its flash memory, according to a report by Taiwan’s Central News Agency (CNA).

iFixit’s teardown analysis shows that the latest 13-inch Apple MacBook Pro employs Winbond’s SpiFlash 64Mb serial flash memory codenamed W25Q64FV. Apple in its 2015 series of 13-inch MacBook Pro also used Winbond’s flash chips codenamed 25064FVIQ, the report indicated.

Apple on October 27 introduced what the company claims is the thinnest and lightest MacBook Pro series ever.

Winbond recently disclosed the company would complete the installation of manufacturing equipment for its new Fab C at the end of 2016, and have the fab enter wafer production in the first quarter of 2017. The arrival of new capacity will further drive the company’s growth.

Winbond specializes in specialty DRAM and flash memory. The company reported net profits for the third quarter of 2016 increased 2.7% sequentially to NT$660 million (US$20.9 million) with EPS reaching NT$0.18.

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Categories: Bits + chips IT + CE IT components, peripherals Memory chips

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