Home General Various News Vapor chamber may become new heat-dissipation choice fo…

Vapor chamber may become new heat-dissipation choice fo…

222

  • Register
Taipei, Wednesday, May 24, 2017 00:15 (GMT+8)
thunderstorms
Taipei
31°C

  • Article
  • . (0)
  • Related content
  • Company info
Print Email

Vapor chamber may become new heat-dissipation choice for smartphones
Aaron Lee, Taipei; Adam Hwang, DIGITIMES [Tuesday 23 May 2017]

Smartphone vendors have been eager to try out vapor chamber technology to improve heat dissipation efficiency, with Taiwan-based Asustek Computer and China-based ZTE having undertaken small-volume trial use and Apple rumored to be interested in the solution, according to Taiwan-based suply chain makers.

Taiwan-based thermal pipe makers Chaung Choung Technology, Asia Vital Components and TaiSol Electronics as well as Japan-based Furukawa Electric have been developing vapor chamber heat-dissipation solutions for use in smartphones, the sources said.

While most smartphone vendors adopt graphite heat-dissipation modules, Samsung Electronics and LG Electronics have taken the initiative to adopt heat-dissipation metal pipes with diameter of 0.35-0.40mm for their smartphones, with such heat-dissipation pipes mainly supplied by Chaung Choung, Furukawa Electric and Taiwan-based Auras Technology and Delta Electronics, the sources noted.

Vapor chamber solutions are superior to heat-dissipation pipes in efficiency of heat dissipation, the sources said. While thickness of vapor chamber modules stands at 0.38mm currently, Apple reportedly prefers thickness of 0.30mm, the sources noted. However, the small gap of 0.08mm will pose big challenges to technology in product development and yield rate in production, the sources indicated.

Graphite heat-dissipation modules are popular for smartphones mainly due to cost consideration, for the average price for a graphite heat-dissipation module stands at US$0.60-0.70, much lower than that of US$0.90-1.00 for a heat-dissipation pipe, the sources said. However, the latter has much higher heat dissipation efficiency with thermal conductivity K-values of 5,000-8,000 in comparison with K-values of about 1,500 for the former, the sources noted.

Tweet

Categories: IT + CE IT components, peripherals Mobile + telecom Mobile components

Tags: Asustek Computer

Companies: Asustek Computer

    Related stories

  • Samsung, LG adopt thermal pipes for smartphones to be launched in 2017 (Jan 18)
  • Thermal module maker Sunonwealth reports increased revenues for December (Jan 11)
  • Delta, Furukawa land heat-pipe orders from LG, say Taiwan makers (Dec 2)
  • Taiwan ultra-thin heat-pipe makers under price cut pressure (May 31)
  • 0.4mm thermal pipes may be used in smartphones in 2015, say Taiwan makers (Feb 5)
  • Taiwan makers look to demand for thin heat-pipes used in smartphones (Apr 8)
Realtime news
  • 3S teaming up with Marvell to develop 28nm controller chips

    Bits + chips | 1h 35min ago

  • Taiwan April manufacturing production index down on month, up on year, says MOEA

    Bits + chips | 1h 36min ago

  • Globalfoundries and Chengdu partner to expand FD-SOI ecosystem in China

    Bits + chips | 1h 38min ago

  • Taiwan April manufacturing production index down on month, up on year, says MOEA

    Before Going to Press | 1h 50min ago

  • Weltrend to see revenues expand by double-digit rate in 2017

    Before Going to Press | 1h 51min ago

  • Taiwan market: Samsung launches Samsung Pay

    Before Going to Press | 1h 51min ago

  • Foxconn Electronics, Sharp to invest in R&D of Micro LED

    Before Going to Press | 1h 52min ago

  • POS maker Posiflex to ramp up capacity by 30%

    Before Going to Press | 1h 56min ago

  • ChipMOS reportedly lands gold bumping orders for AMOLED driver ICs from Samsung

    Before Going to Press | 1h 57min ago

  • Micro LED to come into trial production in 2H17

    Before Going to Press | 1h 57min ago

  • LG Display setting up 10.5G TFT-LCD factory in South Korea

    Before Going to Press | 1h 58min ago

  • AUO procures production equipment from Applied Materials South East

    Before Going to Press | 2h 1min ago

  • Globalfoundries and Chengdu partner to expand FD-SOI ecosystem in China

    Before Going to Press | 2h 3min ago

  • Topco 2017 revenues to rise over 10%

    Before Going to Press | 2h 5min ago

  • Newmax sets new share price for private placement

    Before Going to Press | 2h 5min ago

  • SMIC eyeing top-3 spot in pure-play foundry segment

    Before Going to Press | 2h 6min ago

  • AUO showcasing feature display panels at SID Display Week 2017

    Before Going to Press | 2h 6min ago

Pause
 | 
View more

UMC
Wireless broadband developments in Southeast Asia markets
Analysis of China revised domestic semiconductor industry goals
Sponsored links
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.

Buy link

Source

LEAVE A REPLY

Please enter your comment!
Please enter your name here