There’s at all times one thing smaller. TSMC as we speak introduced its 6-nanometer (N6) course of, which offers a enhancement of its 7nm expertise and affords prospects a extremely aggressive performance-to-cost benefit in addition to quick time-to-market with direct migration from N7-based designs.
By leveraging the brand new capabilities in excessive ultraviolet (EUV) lithography gained from the N7+ expertise at the moment in danger manufacturing, TSMC’s N6 course of delivers 18% greater logic density over the N7 course of. At the identical time, its design guidelines are totally suitable with TSMC’s confirmed N7 expertise, permitting its complete design ecosystem to be reused. As a consequence, it affords a seamless migration path with a quick design cycle time with very restricted engineering assets for purchasers to attain the product advantages from the brand new expertise providing.
Scheduled for danger manufacturing within the first quarter of 2020, TSMC’s N6 expertise offers prospects with extra cost-effective advantages whereas extending the industry-leading energy and efficiency from the 7nm household for a broad array of functions, starting from high-to-mid finish cell, shopper functions, AI, networking, 5G infrastructure, GPU, and high-performance computing.
“TSMC N6 technology will further extend our leadership in delivering product benefits with higher performance and cost advantage beyond the current N7,” mentioned Dr. Kevin Zhang, TSMC Vice President of Business Development. “Building upon the broad success of our 7nm technology, we’re confident that our customers will be able to quickly extract even higher product value from the new offering by leveraging a well-established design ecosystem today.”
