TSMC, Taiwan’s flagship producer of silicon, has seen a considerable improve in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging know-how, in line with the report from DigiTimes. CoWoS is a multi-chip packaging know-how that offers an choice to construct silicon like LEGO, permitting for dies to be positioned aspect by aspect on interposer that’s offering excessive interconnect density and efficiency. You can see extra about CoWoS intimately right here. Some of the examples of CoWoS are NVIDIA’s P100 and V100 dies that combine logic (computing components), and reminiscence (within the type of HBM) on a single die.
Recently, TSMC up to date its CoWoS know-how, the place this new second-generation components may scale far bigger than the first-generation implementation – as much as 1700 squared millimeters of die area, permitting for some very artistic options to be carried out. This could be the purpose that the demand in Q2 has risen so considerably and that TSMC’s manufacturing strains are actually operating at full capability, making an attempt to fulfill the demand for this packaging know-how.
