Taiwan’s MPI Corporation is about to profit from a significant shift in semiconductor testing, as international cloud suppliers ramp up customized AI chip growth and drive demand for superior wafer probe playing cards. Starting in 2026, Google and Amazon Web Services (AWS) are anticipated to steer a surge in CoWoS superior packaging capability, powered by their in-house AI application-specific built-in circuits (ASICs). These chips have already progressed from 7nm to 5nm and 4nm, with the subsequent wave concentrating on sub-3nm nodes.
