SMART Modular Launches 32GB Low-profile DDR4-3200 Mini-DIMMs

SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a frontrunner in specialty reminiscence, storage and hybrid options together with reminiscence modules, Flash reminiscence playing cards and different stable state storage merchandise,in the present day introduced its lineup of DDR4-3200 32 GB Low Profile industrial Mini-DIMMs. SMART has a number of new 32 GB Mini-DIMMs which embody ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC choices to fulfill a variety of use instances. SMART has been offering Mini-DIMM assist for a few years, providing prospects long-term assist in addition to a stable roadmap of latest higher-density, higher-speed choices.

SMART’s DDR4-3200 32 GB industrial Mini-DIMMs endure stringent in-house environmental temperature screening to function between -40 °C to +85 °C which makes SMART’s DDR4 Mini-DIMMs a super answer for telecom and networking tools being deployed beneath harsh working situations. Customized ruggedizing options may be added, resembling conformal coating and anti-sulfur resistors to guard in opposition to poisonous working situations or underfill for extreme vibration, all to permit dependable, long-term system operation.

DDR4 Mini-DIMMs are designed with extra energy and floor pins in comparison with SO-DIMMs. Mini-DIMMs are JEDEC-standard, an business normal which SMART initially helped to develop. The additional energy and floor pins guarantee strong system operation beneath harsh situations. Systems with Mini-DIMMs usually undergo NEBS compliance testing, making certain conformance of a community product to the necessities of the Network Equipment Building System (NEBS) normal. Compliance to this normal signifies {that a} community product or telecommunications tools performs at its optimum capability.

SMART’s high-density industrial Mini-DIMM are supplied in ULP top (17.78 mm) and VLP top (18.75 mm) to accommodate all kinds of system board top necessities. Mini-DIMMs are supported by connectors from Molex and Foxconn, permitting Mini-DIMMs to be both mounted vertically, angled at 22.5°, or at a proper angle to the system board. They even have strong latching mechanisms designed for a seven or extra yr product lifecycle. Mini-DIMMs are some of the versatile reminiscence options getting used in the present day for modern telecom and networking purposes.

These new Mini-DIMMs add to an already strong product household line-up of DDR4 Mini-DIMMs supplied by SMART. For extra info please contact SMART Modular Technologies (www.smartm.com).

SMART can be showcasing its line of Specialty Memory options at Embedded World Exhibition and Conference 2020 from February 25-27 on the Nuremberg Messe in Germany. SMART’s stand is situated in Hall 2, stand 2-555. Attendees are inspired to go to the stand to study SMART’s full line of Specialty Memory merchandise for the embedded business.