SK hynix this week introduced plans to construct its superior reminiscence packaging facility in West Lafayette, Indiana. The transfer might be thought-about as a milestone each for the reminiscence maker and the U.S., as that is the primary superior reminiscence packaging facility within the nation and the corporate’s first vital manufacturing operation in America. The facility will probably be used to construct next-generation varieties of high-bandwidth reminiscence (HBM) stacks when it begins operations in 2028. Also, SK hynix agreed to work on R&D initiatives with Purdue University.
“We are excited to become the first in the industry to build a state-of-the-art advanced packaging facility for AI products in the United States that will help strengthen supply-chain resilience and develop a local semiconductor ecosystem,” mentioned SK hynix CEO Kwak Noh-Jung.
One of The Most Advanced Chip Packaging Facility Ever
The facility will deal with meeting of HBM recognized good stacked dies (KGSDs), which include a number of reminiscence units stacked on a base die. Furthermore, will probably be used to develop next-generations of HBM and can due to this fact home a packaging R&D line. However, the plant is not going to make DRAM dies themselves, and can doubtless supply them from SK hynix’s fabs in South Korea.
The plant would require SK hynix to take a position $3.87 billion, which can make it some of the superior semiconductor packaging services on the planet. Meanwhile, SK hynix held the funding settlement ceremony with representatives from Indiana State, Purdue University, and the U.S. authorities, which signifies events financially concerned within the venture, however this week’s occasion didn’t disclose whether or not SK hynix will obtain any cash from the U.S. authorities below the CHIPS Act or different funding initiatives.
The price of the power considerably exceeds that of packaging services constructed by different main gamers within the trade, equivalent to ASE Group, Intel, and TSMC, which highlights how vital of an funding that is for SK hnix. In reality, $3.87 billion larger than superior packaging CapEx budgets of Intel, TSMC and Samsung in 2023, based mostly on estimates from Yole Intelligence.
Given that the fab comes on-line in 2028, based mostly on SK hynix’s product roadmap we might count on that will probably be used no less than partially to assemble HBM4 and HBM4E stacks. Notably, since HBM4 and HBM4E stacks are set to function a 2048-bit interface, their packaging course of will probably be significantly extra advanced than the present 1024-bit HBM3/HBM3E packaging and would require utilization of extra superior instruments, which is why it’s poised to be costlier than some current superior packaging services. Due to the extraordinarily advanced 2048-bit interface, many chip designers who’re going to make use of HBM4/HBM4E are anticipated to combine it straight onto their processors utilizing hybrid bonding and never use silicon interposers. Unfortunately, it’s unclear whether or not the SK hynix facility will be capable to supply such service.
HBM is principally used for AI and HPC purposes, so it’s strategically vital to have its manufacturing within the U.S. Meanwhile, precise reminiscence dies will nonetheless must be made elsewhere, at devoted DRAM fabs.
Purdue University Collaboration
In addition to assist set to be offered by state and native governmens, SK hynix selected to determine its new facility in West Lafayette, Indiana, to collaborate with Purdue University in addition to with Purdue’s Birck Nanotechnology Center on R&D initiatives, which incorporates superior packaging and heterogeneous integration.
SK hynix intends to work in partnership with Purdue University and Ivy Tech Community College to create coaching applications and multidisciplinary diploma programs geared toward nurturing a talented workforce and establishing a constant stream of rising expertise for its superior reminiscence packaging facility…
