SK hynix and TSMC introduced early on Friday that they’d signed a memorandum of understanding to collaborate on creating the next-generation HBM4 reminiscence and superior packaging know-how. The initiative is designed to hurry up the adoption of HBM4 reminiscence and solidify SK hynix’s and TSMC’s main positions in high-bandwidth reminiscence and superior processor functions.
The major focus of SK hynix’s and TSMC’s preliminary efforts might be to reinforce the efficiency of the HBM4 stack’s base die, which (if we put it very merely) acts like an ultra-wide interface between reminiscence gadgets and host processors. With HBM4, SK hynix plans to make use of one in all TSMC’s superior logic course of applied sciences to construct base dies to pack extra options and I/O pins throughout the confines of current spatial constraints.
This collaborative method additionally permits SK hynix to customise HBM options to fulfill numerous buyer efficiency and vitality effectivity necessities. HBM has been touting customized HBM options for some time, and teaming up with TSMC will undoubtedly assist with this.
“TSMC and SK hynix have already established a robust partnership over time. We’ve labored collectively in integrating probably the most superior logic and state-of-the artwork HBM in offering the world’s main AI options,” mentioned Dr. Kevin Zhang, Senior Vice President of TSMC’s Business Development and Overseas Operations Office, and Deputy Co-Chief Operating Officer. “Looking forward to the next-generation HBM4, we’re assured that we are going to proceed to work carefully in delivering the best-integrated options to unlock new AI improvements for our frequent clients.“
Furthermore, the collaboration extends to optimizing the combination of SK hynix’s HBM with TSMC’s CoWoS superior packaging know-how. CoWoS is among the many hottest specialised 2.5D packaging course of applied sciences for integrating logic chips and stacked HBM right into a unified module.
For now, it’s anticipated that HBM4 reminiscence might be built-in with logic processors utilizing direct bonding. However, a few of TSMC’s clients may desire to make use of an ultra-advanced model of CoWoS to combine HBM4 with their processors.
“We count on a robust partnership with TSMC to assist speed up our efforts for open collaboration with our clients and develop the business’s best-performing HBM4,” mentioned Justin Kim, President and the Head of AI Infra at SK hynix. “With this cooperation in place, we are going to strengthen our market management as the entire AI reminiscence supplier additional by beefing up competitiveness within the house of the customized reminiscence platform.“
