Home IT Hardware Assets Samsung Showcases Its Latest Silicon Technologies for the

Samsung Showcases Its Latest Silicon Technologies for the

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Samsung’s new-generation processors and reminiscence options set to energy innovation throughout cellular, house, information middle, and automotive markets

 

Samsung Electronics, a world chief in superior semiconductor expertise, showcased superior reminiscence and system logic gadgets at its Tech Day 2019 occasion. Fueling the way forward for tech for 5G, AI, cloud, edge, IoT, and autonomous autos, Samsung highlighted new processor and reminiscence system capabilities. The firm unveiled the Exynos 990 premium cellular processor, the 5G-enabled Exynos Modem 5123 and introduced mass manufacturing of its third era 10nm-class 1z-nm DRAM.

 

“Samsung is focused on harnessing the most advanced semiconductor technologies to power innovation across key markets,” mentioned JS Choi, president, Samsung Semiconductor. “From System LSI devices that are perfectly adapted for real-world 5G and AI, to advanced solid-state drives (SSDs) that handle mission-critical tasks and offload CPU workload, we are determined to deliver infrastructure capabilities that are built to enable every wave of innovation.”

 

New expertise bulletins embrace:

 

  • Exynos 990 and 5G Exynos Modem 5123: Delivers unprecedented AI-powered consumer experiences on-device with a dual-core neural processing unit (NPU) and enhanced digital sign processor (DSP) that may carry out over ten-trillion operations per second. The Exynos 990 and 5G Exynos Modem 5123 harness essentially the most superior chipmaking applied sciences to-date with a 7-nanometer (nm) course of utilizing excessive ultraviolet (EUV) lithography.

 

  • Third-generation 10nm-class (1z-nm) DRAM: Delivers the {industry}’s highest efficiency, power effectivity and capability, since mass manufacturing in September. Optimized for premium server platform improvement, the 1z-nm DRAM will open the door to a lineup of reminiscence options on the cutting-edge reminiscent of DDR5, LPDDR5, HBM2E and GDDR6 merchandise as early as the start of subsequent yr.

 

  • 12GB LPDDR4X uMCP (UFS-based multichip package deal): Combines 4 24Gb LPDDR4X chips and an ultra-fast eUFS 3.zero NAND storage right into a single package deal, breaking by means of the present 8GB package deal restrict in mid-range smartphones and bringing greater than 10GB of reminiscence to the broader smartphone market.

 

Samsung additionally proposed new enterprise potentialities for next-generation reminiscence applied sciences, together with the corporate’s Seventh-generation V-NAND with almost 200 (1yy) cell layers for cellular and different premium reminiscence options, and next-generation PCIe Gen5 SSDs for future server and storage purposes.

 

Samsung’s third annual Tech Day hosted Silicon Valley’s main corporations, featured buyer collaborations on GPU, PCIe Gen4 and HBM2e applied sciences, an industry-leading buyer panel, and a demo pavilion showcasing the way forward for house automation, information facilities, cellular/5G, and automotive expertise.

 

“The proliferation of technological advances in 5G, edge computing and AI is changing the world at an exponential pace.  The impact of AI will be everywhere, from new avenues for communication and unprecedented connections. AI’s impact will be seen everywhere. Self-driving cars will take to our roads and homes and businesses will become truly connected,” mentioned Choi. “To enable such innovations, technology infrastructure must lead the way. Samsung is committed to being at the heart of all this innovation — and it will be fascinating to see what the world can do.”



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