Samsung not too long ago started sampling of its 32 Gb capability DDR4 reminiscence chips. The new merchandise will simplify manufacturing of high-capacity reminiscence modules that use a number of DRAM packages.
Samsung’s 32 Gb A-die DDR4-2666 chips are comprised of two stacked 16 Gb DDR4 dies produced utilizing the corporate’s 10 nm-class course of expertise. Samsung gives two variations of 32 Gb DDR4 packages: one that includes a 2G x8 group, one other that includes a 1G x16 group. The former is seen by reminiscence controller as two reminiscence gadgets, whereas the latter is taken into account as one DRAM gadget. The DDPs (twin die packages) are available commonplace 78 or 96-ball FBGA form-factor and use the industry-standard voltage of 1.2 V.
JEDEC’s DDR4 specification solely describes 4 Gb, 8Gb, and 16 Gb reminiscence gadgets. As a end result, DRAM makers have to make use of superior packaging methods to construct chips for high-capacity reminiscence modules for servers or workstations. DDPs usually are not one thing significantly new, however 32 Gb DDR4-2666 DDPs are distinctive to Samsung.
32 Gb DDR4 reminiscence chips will allow makers of modules and PCs to make use of fewer DRAM chips for constructing high-capacity options for purposes that require excessive reminiscence density or small form-factors. Obviously, dual-rank reminiscence modules will nonetheless require assist from reminiscence controllers, however at the very least it is going to be simpler to construct high-capacity reminiscence sub-systems utilizing these chips.
Samsung doesn’t disclose pricing of its 32 Gb DDR4-2666 DDPs, however it’s apparent that they are going to be offered at a premium given the truth that they’re solely accessible from Samsung and they’re tougher to construct than SDPs.
Source: Samsung
Note: Images of DRAM modules are for illustrative functions solely.
