Home Update Samsung Develops Smaller DDR4 Dies Using third Gen 10nm-Class

Samsung Develops Smaller DDR4 Dies Using third Gen 10nm-Class

287


Samsung has accomplished improvement of its 3rd-generation 10 nm-class manufacturing course of for DRAM in addition to the primary 8 Gb DDR4 chip that makes use of the know-how. The 1z-nm course of know-how is claimed to be the world’s smallest course of node for reminiscence, and can allow Samsung to extend productiveness while not having to go to excessive ultraviolet lithography (EUVL) right now. The firm plans to begin quantity manufacturing utilizing the know-how within the second half of 2019.

Samsung says that its 3rd Generation 10 nm-class manufacturing know-how (also referred to as 1z-nm) for DRAM allows it to make 20% extra 8 Gb DDR4 reminiscence chips per wafer than the twond Gen 10-nm class (aka 1y-nm) does. An improve of the variety of dies per wafer primarily implies that the brand new 8 Gb DDR4 gadget is roughly 20% smaller* than the previous-gen 8 Gb DRAM, which implies a tangible lower of manufacturing prices on the similar yield and on the similar cycle time. This ought to imply cheaper DRAM pricies for shoppers.

Samsung historically doesn’t disclose actual smallest half-pitch dimension of the brand new reminiscence gadget, so right now we would not have any details about the brand new chip’s geometries. Since we’re coping with a 1z node, it’s cheap to imagine that the smallest half-pitch dimension is effectively beneath 15 nm, however that is hypothesis.

The world’s largest maker of reminiscence is very proud that its 3rd Generation 10 nm-class manufacturing know-how for DRAM continues to make use of ArF (argon fluoride) immersion lithography instruments and doesn’t require EUVL. Keeping in thoughts that ultra-thin nodes require multi-patterning in case of immersion lithography, it’s logical to imagine that Samsung makes use of this technique together with varied methods to make sure good yields and efficiency.

Samsung will begin manufacturing of 8 Gb DDR4 reminiscence chips utilizing its 1z-nm fabrication course of within the second half of the 12 months. The first merchandise based mostly on the 8 Gb 1z chips might be DDR4 DRAM modules. Once they’re validated by CPU designers, they are going to be used for PCs in 2020.

Going ahead, the identical manufacturing know-how might be used to provide DRAMs with “higher capacities and performance”.

Related Reading

Source: Samsung

*Note: This is a really tough calculation.



Source hyperlink

LEAVE A REPLY

Please enter your comment!
Please enter your name here