Samsung Electronics, a world chief in superior semiconductor expertise, made a case in the present day to accommodate the rise of applied sciences like 5G and AI, in addition to the COVID-19-accelerated explosion of knowledge, with the reminiscence of tomorrow that might want to supply new ranges of energy efficiency and connectivity not like something seen earlier than.
In a keynote speech on the 2021 Global Semiconductor Alliance (GSA) Memory+ Conference, Jinman Han, Executive Vice President and Head of Memory Global Sales and Marketing at Samsung Electronics, proclaimed that Samsung was able to work with the whole business to develop next-generation reminiscence options that shall be wanted within the close to future. The GSA Memory+ Conference is the Global Semiconductor Alliance’s premier occasion, which brings the worldwide reminiscence, logic and system design communities collectively to debate advancing reminiscence and system architectures.
The reminiscence business has lengthy centered its efforts on satisfying demand for bigger capacities and quicker speeds, in addition to increased bandwidth. However, as a way to sustain with rising demand, the business might want to look past particular person improvements and assess the larger image. Samsung is dedicated to collaborating with the business on this space and intends to steer the event of next-generation options.
The large and ongoing rise in information has uncovered a necessity for revolutionary change in reminiscence computation and subsystems. In response, Samsung has been main the event of applied sciences that can be utilized to provide current system architectures a much-needed replace, together with HBM-PIM, AXDIMM, Smart SSDs and CXL-based DRAM.
Having been the primary within the reminiscence business to make the most of EUV and HKMG course of expertise, Samsung is uniquely positioned to introduce in a brand new period of highly effective reminiscence improvements. The firm has been optimizing thermal efficiency by advancing improvements like Hybrid Copper Bonding (HCB), whereas its V-NAND applied sciences proceed to redefine how reminiscence is stacked.
“I believe our industry will rise to this challenge not by innovating independently, but by finding solutions together,” mentioned Han. “Going forward, we’ll develop a new IT ecosystem together that is much more powerful and sustainable, one which will be needed to architect the digital future.”
Click on the video under to observe the keynote.
