Samsung ‘X-Cube’ permits industry-first 3D SRAM-logic working silicon at 7nm and past.
Bandwidth and density might be scaled to swimsuit numerous design necessities in rising purposes.
Samsung Electronics, a world chief in superior semiconductor expertise, immediately introduced the quick availability of its silicon-proven 3D IC packaging expertise, eXtended-Cube (X-Cube), for immediately’s most superior course of nodes. Leveraging Samsung’s through-silicon by way of (TSV) expertise, X-Cube permits important leaps in pace and energy effectivity to assist deal with the rigorous efficiency calls for of next-generation purposes together with 5G, synthetic intelligence, high-performance computing, in addition to cellular and wearable.
“Samsung’s new 3D integration technology ensures reliable TSV interconnections even at the cutting-edge EUV process nodes,” stated Moonsoo Kang, senior vice chairman of Foundry Market Strategy at Samsung Electronics. “We are committed to bringing more 3D IC innovation that can push the boundaries of semiconductors.”
*The picture proven is for illustration objective solely.
With Samsung’s X-Cube, chip designers can get pleasure from higher flexibility to construct customized options that greatest swimsuit their distinctive necessities. The X-Cube check chip constructed on 7nm makes use of TSV expertise to stack SRAM on prime of a logic die, releasing up area to pack extra reminiscence right into a smaller footprint. Enabled by 3D integration, the ultra-thin bundle design options considerably shorter sign paths between the dies for maximized knowledge switch pace and vitality effectivity. Customers may also scale the reminiscence bandwidth and density to their desired specs.
Samsung X-Cube’s silicon-proven design methodology and move can be found now for superior nodes together with 7nm and 5nm. Building on the preliminary design, Samsung plans to proceed collaborating with world fabless clients to facilitate the deployment of 3D IC options in next-generation high-performance purposes.
More particulars on Samsung X-Cube will probably be introduced at Hot Chips, an annual convention on high-performance computing, which will probably be livestreamed Aug. 16-18.
