Rohm rolls out ultra-compact MOSFET for automotive purposes
Julian Ho, Taipei; Steve Shen, DIGITIMES
Rohm has unveiled its ultra-compact MOSFET chips sized 1.0×1.0mm, together with RV8xxx- and BSS84XHZG-series that meet AEC-Q101 reliability requirements for automotive electronics purposes.
The RV8xxx-series and BSS84XHZG make the most of Rohm’s Wettable Flank formation know-how, the corporate stated.
BSS84XHZG MOSFET chips ship automotive-grade mounting reliability and efficiency below excessive situations in addition to constant solder high quality even for backside electrode sort merchandise, Rohm pressured.
The BSS84XHZG additionally permits computerized inspection machines to confirm solder situations after mounting. It permits the miniaturization of automotive elements, comparable to ECU, ADAS digital camera modules, that demand top quality, the corporate added.
It has already kicked off quantity manufacturing of those ultra-compact MOSFET chips.
