- Register
- Login
18°C
- Article
- . (0)
- Related content
- Company info
Advanced Semiconductor Engineering (ASE), Qualcomm and the Brazil government reportedly have signed a MOU to jointly invest US$200 million initially to establish an IC testing/packaging plant in Sao Paulo, according to Chinese-language Commercial Times Report.
ASE confirmed the signing of the MOU for cooperation, but said the investment project remains in the discussion stage without concrete planning.
The planned investment project aims to build up a semiconductor supply chain in Brazil to meet increasing chip demand for smartphones and IoT devices in Brazil and other markets in Central and South America, indicated the paper.
The potential investment plan in Brazil comes after ASE COO Tien Wu said earlier that the company has no plans to build new plants for IC packaging services in the US although it does currently runs two IC testing facilities in California and Texas.
ASE currently also offers IC backend services in Taiwan, Japan, Korea, Singapore, Malaysia and Mexico.
-
Samsung, eSilicon tape out 14nm network processor with Rambus 28G SerDes solution
Bits + chips | 4h 58min ago
-
Apple iPhone 6s tops list of best-selling smartphones for 2016, says IHS
Mobile + telecom | 5h 1min ago
-
ASE says no plan to set up local site in US for packaging services
Bits + chips | 5h 3min ago
-
SAS suffers net loss per share of NT$2.77 for 2016
Before Going to Press | 5h 14min ago
-
Digitimes Research: 3G/4G becomes mainstream in India in 2016-2017
Before Going to Press | 5h 15min ago
-
Nintendo expects to ship 20 million Switch devices in first year, say Taiwan makers
Before Going to Press | 5h 17min ago
-
Everlight Electronics nets NT$4.13 per share for 2016
Before Going to Press | 5h 18min ago
-
Lenovo plans to offer 3-5 Mods smartphone accessories a quarter
Before Going to Press | 5h 19min ago
-
Chunghwa Telecom procures 4G equipment from Nokia
Before Going to Press | 5h 22min ago
-
AUO procures TFT-LCD equipment
Before Going to Press | 5h 23min ago
-
India market: Handset sales proportion from online channels rises to nearly 35%
Before Going to Press | 5h 23min ago
-
Systex nets NT$4.50 per share for 2016
Before Going to Press | 5h 26min ago
-
Bright Led Electronics to hand out 2016 dividend of NT$0.80
Before Going to Press | 5h 27min ago
-
GMT to deal out 2016 dividend of NT$5
Before Going to Press | 5h 29min ago
-
TSMC to begin 7nm tape-out in 2H17
Before Going to Press | 5h 29min ago
-
Win Semi to deal out cash dividend of NT$4.50 for 2016
Before Going to Press | 5h 30min ago
-
SPIL to pay NT$1.75 cash dividend for 2016
Before Going to Press | 5h 37min ago
-
InterServ International to not hand out 2016 dividend
Before Going to Press | 5h 39min ago
-
Oppo actively tapping overseas markets
Before Going to Press | 5h 40min ago
-
Audio IC firm C-Media 2016 profits fall to 3-year low
Before Going to Press | 5h 41min ago
- Wireless broadband developments in Southeast Asia markets
As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.
- 2015 global tablet demand forecast
This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.
- 2015 China smartphone panel trend forecast
This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.
