Intel this week announced its mobile MCM processor based on a 14 nm Coffee Lake-H CPU cores and a Vega based graphics solution. This is called a multi-chip module, and the first photo just surfaced. And it’s totally weird to observe alright.
Intel plans this laptop-computer chip combining an Intel processor and an AMD graphics unit. The new product, which will be part of the 8th Gen Intel Core family, brings together our high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD’s Radeon Technologies Group – all in a single processor package, but based on several dies.
A photo surfaced online showing the massively huge MCM design, as shared by tech website Bits’ n Chips on Twitter. On the left-hand side of the photo, you can see the Intel processor and to the left, the larger AMD GPU with the HBM2 stack.
A 14nm Vega architecture was the choice for the GPU, Intel mentions the usage of HBM2. Earlier this year Intel already announced their Embedded Multi-Die Interconnect Bridge (EMIB) making these things (a second die) possible, for modular builds. The Intel and the AMD part communicate over what basically is a PCIe Gen 3.0 bridge wired in-between each other. The first products based on MCMs will likely be embedded products and laptops, they should launch by Q1 2018.
