Overclocking of a Skylake-X processor is not a simple task due to the inefficient thermal-interface material (TIM) being used instead of solder, (which offers much better thermal performance). Roman ‘der8auer’ Hartung who already designed a delid tool now also releases a cooling plate, a frame that can be mounted directly further reducing the temperatures of the processor by 5 to 10 °C.
Funny how Intel creates a market for and companies like caseking cashing in thick and steep, as the pieces of alu plate and five screws cost €70 (!), all that to fix Intel’s mistakes. Basically, the plate enables installation of Skylake-X CPUs without a heat spreader.
Technical Details:
- Type: CPU mounting frame
- Material: Anodized aluminium
- Colour: Black
- Compatible with all Socket 2066 motherboards
- Compatible with all Intel Skylake-X processors
- Includes:
1x Direct Die Frame
1x Back plate
5x M3 screws
1x Hex key
1x Torx key
1x Plastic spatula
The nickel-plated copper heat spreader, in the factory default setup, removes the heat produced by the CPU and transfers it into the CPU cooler which dissipates the thermal energy across a larger surface area than that available to the silicon alone. However the role of forming a tight seal between said components falls to a Thermal Interface Material (TIM) located between the heat spreader and the silicon chip. This standard thermal paste supplied with Intel processors offers relatively low levels of thermal conductivity, as a result of this it frequently struggles to maintain reasonable temperatures when faced with heavy overclocking.
In this scenario the effectiveness of the CPU cooler is irrelevant due to the fact that heat the heat build-up is taking place within the interior of the processor package itself. For a CPU to receive adequate cooling, even when being pushed to its limits via overclocking, enthusiasts swiftly remove the heat spreader with the help of the der8auer Delid Die Mate X, replacing the thermal paste with liquid metal and subsequently remounting the heat spreader. This results in a typical 10-20 °C reduction in the temperatures of Intel Skylake-X processors. The Skylake-X Direct Die Frame removes the need for two further layers consisting of the heat spreader and thermal paste, allowing temperatures to fall by a further 5-10 °C. This results in a marked improvement in overclocking performance.
The outer edge of the der8auer Skylake-X Direct Die Frame is located a mere 0,1 mm below the silicon chip itself, effectively preventing any unwanted tilting of the CPU cooler and protecting against damage. Furthermore, the black anodized coating isolates the aluminium of the Direct Die Frame as it is no longer electrically conductive. As a result the SK-X DDF can be seated safely and securely against the contact area of the CPU. Installation of the SK-X DDF requires that the Intel socket retention model first be removed, this then allows the bundled back plate to be attached to the reverse of the motherboard with adhesive pads, the CPU inserted, and the frame secured by means of four screws. The SK-X DDF is manufactured according to extremely tight tolerances to ensure an equal distribution of downward force. This helps to maintain optimum contact between the motherboard and CPU while ensuring all devices, such as PCIe cards or RAM modules, are recognized correctly.
The Skylake-X Direct-Die Cooling Frame is available now from Caseking for €69,99.
