Chinese leakster @KJuma today shared alleged leaked presentation slides for Meizu’s upcoming flagship the Pro 7. The slides suggest the smartphone will be powered by Huawei’s Kirin 960 octa-core SoC, which uses Cortex-A73 cores and the new Mali-G71 GPU with Vulkan support. Last year, Meizu used the Samsung Exynos 7420 chipset for the Pro 5, but it appears Meizu was more impressed by the Kirin 960 SoC than Samsung’s Exynos 8890 this year.
The move does make sense, as the Kirin 960 does have an edge over the Exynos 8890 as well as the Qualcomm Snapdragon 821 in some CPU-intensive benchmarks. However, in terms of GPU performance, the Kirin 960 falls behind the new Snapdragon 821.
The Meizu Pro 7, like a number of other recent Android flagship smartphones, will be equipped with 6GB of LPDDR4 RAM as well. Onboard storage however, isn’t listed in any of the leaked presentation slides. In the camera department, the Pro 7 is going to be similar to the MX6 , featuring the 12MP Sony IMX386 sensor at the back.
One of the key highlights of the upcoming flagship could be an under-glass fingerprint scanner, developed by Sonavation Inc. It has also been rumored that the Pro 7 could feature a near bezel-less front, similar to what Xiaomi has done with the Mi Mix. None of the leaked slides show the Pro 7 clearly from the front, so that hasn’t been confirmed by today’s leak.
The Meizu Pro 7 is expected to be made official at an event in China on December 24th.
Via: Playfuldroid
