While Samsung and TSMC might be having hard times producing 10nm chipsets at the moment, MediaTek wants to launch next-gen flagship chipset in 2018. MediaTek and TSMC are working on next-generation flagship mobile chipsets that will be manufactured using the new 7nm process.
The goal is to launch the new Helio chipset in the first half of 2018 and judging by the specs, it should be very powerful. According to industry sources, MediaTek’s new chip will have a 12-core design, which will be much faster, and more power-efficient than 10nm chips. The reason why MediaTek is adding more cores is apparently a way for them to maintain a balance between power efficiency and performance.
If you think what is after 7nm, then think of 5nm chips. TSMC wants to start a 5nm trial production in 2019.