The LeEco Le Pro 3 is known as one of the first smartphones packed with the latest Snapdragon 821 CPU with 4 Kryo cores clocked at 2.4GHz. This handset has been tested for several times and it showed quite astonishing results. But the upcoming Xiaomi Mi 5S has outrun it that simply means there are actual differences between devices with the same hardware. So it’s a good reason to tear down the LeEco Le Pro 3 to see what’s inside.
Before you scroll down to get acquainted with the internals of the LeEco le Pro 3, I am offering to look at the key features of this awesome handset one more time to be informed about what we should see when dissembling it. Obviously, the selling point of the LeEco Le Pro 3 is its processor paired with a LPDDR4 RAM that is most efficient memory yet and UFS 2.0 storage that has been exclusive for Samsung devices for a long time. But there are other features worthy to be mentioned as well. Among them we can find a 5.5-inch In-Cell screen at 1080p resolution and 2.5D arc glass, Sony a Sony IMX298 16MP camera, a 4070mAh battery with24W fast charge option, dual SIM supporting 4G network at a speed of 600Mbps, and a dual-band dual-antenna (MIMO) WiFi.
The LeEco Le Pro 3 also comes with an eye-catching design sporting a metal unibody housing (the back is also bruished) that gives a business look to the device. This is a high-end smartphone and a pioneer in its category, so everyone has been expected to see high price tags for it. And they have done – the LeEco Le Pro 3 price tags differ from 1799 yuan to 2999 yuan. However, this pricing doesn’t prevent the company to get 3.57 million pre-orders in 24 hours. So let’s look at the tear down photos to get for what we pay.
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