Intel Recalls Boxed Xeon E-2274G Processors Due to

Intel issued a product change notification (PCN) dated November 13, calling for a recall of boxed Xeon E-2274G processors from clients and distributors. The boxed SKU of the E-2274G, which features a inventory cooling answer, has been marked as “discontinued” and “end of life.” Intel is providing an E-2274G tray processor (chip-only) as alternative for the returned stock. The trigger for the recall is the cooling answer included within the boxed SKU, which has been discovered to be inadequate to chill the E-2274G, a 4-core/8-thread processor primarily based on the 14 nm++ “Coffee Lake” microarchitecture, with a rated TDP of 88 W.

The E973708-003 fan-heatsink included with boxed Xeon E-2274G processors is equipped by Foxconn, and has been identified to be bundled with Intel’s entry-level client-segment processors, such because the Pentium Gold sequence and Core i3 sequence (chips with TDP usually rated 65 W or much less). It encompasses a skinny, round, all-aluminium heatsink, which lacks a copper core that sure different LGA115x-compatible inventory coolers by Intel have. The heatsink makes contact with the CPU over pre-applied TIM on an aluminium floor, with spirally-projecting fins dissipating warmth beneath the fan’s airflow. It could possibly be been an oversight bundling such an underpowered cooler with an 88 W TDP processor that is designed for the pains of mission-critical use-cases resembling workstations and small-business servers.