Taiwan-based Group Up Industrial (GP), devoted to supplying automation and semiconductor dry course of gear, has seen clear order visibility via the third quarter of 2019 because of important capability expansions by makers of ABF substrates, COF substrates, substrate-like PCBs (SLP) and 5G-use PCBs, in accordance with firm sources.
GP president JK Li identified that his firm is following the footsteps of main makers in associated fields to develop course of gear for high-end merchandise. In the SLP phase, for example, such main makers as Taiwan’s Zhen Ding Technology (ZDT), Austria’s AT&S, Japan’s Meiko and China’s Shennan Circuit are actually all among the many firm’s shoppers.
Makers of ABF and COF substrates are actively transferring to develop capacities to ease provide shortages, producing important development momentum for GP’s 2019 revenues. Besides Taiwan’s current two main makers of COF substrates increasing capacities, the agency’s main shopper ZDT can be gearing as much as achieve extra from the rising demand for the substrates. Some makers of ABF substrates are additionally finishing up a brand new wave of capability expansions as their current capacities are already absolutely booked by downstream shoppers, in accordance with Lee.
GP can be aggressively continuing with deployments in course of gear for 5G parts. The firm has tapped into the availability chains of 5G-use inflexible PCBs by China’s Shennan Circuits and Wus Printed Circuit, in addition to the availability chains of many manufacturers of versatile boards for 5G antenna and RF transmission options, together with Taiwan’s ZDT, Flexium Interconnect and Career Technology, in addition to China’s DSBJ.
Moreover, GP is growing course of gear for extra auto-use merchandise together with glass ornament boards and batteries, along with conventional automotive PCBs.
GP has additionally zeroed in on higher-end semiconductor course of gear, together with these for FOPLP (fan-out panel stage packaging) and SiP (system in package deal), for its subsequent step of improvement. The firm has began negotiations with world-class shoppers within the packaging phase over cooperative improvement of associated gear.
