Today Huawei took the stage to unveil the brand new Mate 40 collection of units. In the type of the Mate 40, Mate 40 Pro and the Mate 40 Pro+, the brand new telephones symbolize the corporate’s forefront when it comes to know-how, largely enabled by the brand new Kirin 9000 chipset which is manufactured on a brand new 5nm manufacturing node, promising nice leaps in efficiency and effectivity.
The new telephones additionally characteristic an up to date design with a unique digital camera structure, differentiated show design and improved audio system and charging options.
The new Kirin 9000 is are the core of the dialogue – and it’s additionally Huawei’s greatest drawback as the brand new silicon is now not below manufacturing since September as a consequence of US sanctions on the corporate, representing a way more substantial risk than the already present limitations on the corporate’s merchandise, similar to not with the ability to ship with Google Mobile Services.
Huawei Mate 40 Series | ||||
Mate 40 | Mate 40 Pro | Mate 40 Pro+ | ||
SoC | HiSilicon Kirin 9000(E)
1x Cortex-A77 @ 3.13 GHz |
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GPU | Mali G78MP24 Mali G78MP22(E) |
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DRAM | 8GB | 12GB | ||
Display | 6.5″ OLED 2376 x 1080 90Hz 240Hz Touch 68° edge curve |
6.76″ OLED 2772 x 1344 90Hz 240Hz Touch 88° edge curve |
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Size | Height | ? | 162mm | |
Width | ? | 75.5mm | ||
Depth | ? | 9.1mm | ? | |
Weight | ? | 212g | ? | |
Battery Capacity | ?mAh (Rated) ?mAh (Typical) 50W SuperCharge |
?mAh (Rated) 4400mAh (Typical) 50W TremendousCharging |
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Wireless Charging | ?W SuperCharge | 66W SuperCharge | ||
Rear Cameras | ||||
Main | 50MP 1/1.28″ 2.44µm RYYB sensor f/1.9 OIS 23mm eq. |
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Telephoto | 3x Optical 8MP f/2.Four OIS 85mm eq. |
– | 3x Optical 8MP f/2.Four OIS 70mm eq. |
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Periscope Telephoto |
5x Optical 12MP RYYB f/3.Four OIS 125mm eq. |
10x Optical 8MP f/4.Four OIS 240mm eq. |
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Wide | 16MP f/2.2 17mm eq. |
20MP f/1.8 18mm eq.
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20MP f/2.4 14mm eq. zero distortion |
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Extra | ToF | – | ||
Front Camera | Yes | 13MP Wide-angle f/2.4 + TOF sensor |
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Storage | 128GB | 256GB | 256GB | |
+ proprietary “nanoSD” card | ||||
I/O | USB-C | |||
Wireless (native) | 802.11ax (Wifi 6), Bluetooth 5.1 |
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Cellular | 4G + 5G NR NSA+SA Sub-6GHz | |||
Splash, Water, Dust Resistance | IP68 (water-resistant as much as 1m) |
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Dual-SIM | 2x nano-SIM | |||
Launch OS | AOSP 11 w/ EMUI 11
with out Google providers |
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Launch Price | 8+128GB: 899€ |
8+256GB: 1199€ |
12+256GB: 1399€ |
As talked about, the largest information in the present day was the official unveiling of the brand new HiSilicon Kirin 9000 SoC. Manufactured on TSMC’s model new 5nm course of node, the Kirin 9000 represents the second and certain solely different chip design after Apple’s A14 to ship in 2020. Huawei had made a whole lot of parallels to Apple’s and Android SoC rivals similar to Qualcomm – specializing in some essential milestones that the competitors hasn’t but been capable of obtain on the high-end phase, similar to integrating the 5G modem inside the SoC as a substitute of counting on an exterior chip. In this regard, Huawei calls the Kirin 9000 the primary and solely 5nm 5G SoC.
The chip can also be of considerable complexity, as Huawei discloses if options 15.Three billion transistors, 30% greater than the not too long ago introduced Apple A14 which “only” options 11.8bn. An rationalization for the vastly bigger die measurement after all is the inclusion of an on-die modem which is at the moment missing in different SoCs from the competitors (as a consequence of numerous design & value causes). However, the modem isn’t the one IP block that bloats up the die measurement, as HiSilicon opted for a fairly gigantic GPU configuration:
Featuring a Mali-G78MP24, we’re really seeing the chip…