Once a yr the promise of tremendous sizzling potatoes graces the semiconductor world. Hot Chips in 2021 is ready to be held nearly for the second successive yr, and the presentation schedule has simply been introduced. Coming this August, there might be deeper disclosures on next-generation processor architectures, infrastructure compute platforms, new enabling applied sciences corresponding to processing-in-memory, a lot of upcoming AI options, in addition to a deeper look into customized accelerators.
If you thought final yr’s Hot Chips was convention, this one is a powerful competitor. Hot Chips is an annual two-day semiconductor disclosure occasion the place the newest processor know-how from across the {industry} (besides Apple*, see on the backside) is offered by the engineers behind the initiatives. A variety of key gamers use Hot Chips as the primary alternative to advertise key particulars of their designs out there for potential prospects, and startups with sufficient backing additionally get to speak about what makes their new chips distinctive in a crowded market.
A spotlight of every occasion can also be the keynotes, with earlier years involving Dr. Lisa Su, CEO AMD discussing the businesses success, Dr. Phillip Wong of TSMC giving the lay of the land at the vanguard of producing, Jon Masters of Red Hat going via a lot of the problems stemming from Spectre and Meltdown, and Raja Koduri protecting Intel’s imaginative and prescient of a full scalar-vector-matrix-spatial XPU technique.
TSMC Keynote, Hot Chips 31 (2019)
Normally Hot Chips is an on-location occasion, however much like final yr resulting from restrictions on journey it will likely be an all-virtual occasion once more. This signifies that most displays are pre-recorded, however there was a number of interplay on the occasion final yr. Anyone can attend, and the digital costs are low, at most $160, which supplies the attendee with reside displays, an opportunity to ask Q&A, entry to all of the slide decks, and continued entry to the talks for a number of months earlier than they’re made public. Last yr’s on-line resolution went very well.
This yr’s occasion might be held August 22-24th, and can run to the Pacific Time Zone. All instances under are in PT.
| Hot Chips 33 (2021) Schedule | |||
| AnandTech | Time and Session | Session Title | |
| Day 0 Aug 22nd |
08h30 | Tutorial 1 | ML Performance |
| 14h00 | Tutorial 2 | Advanced Packaging | |
| Day 1 Aug 23rd |
08h45 | Session 1 | Processors |
| 11h30 | Session 2 | Academic Spinout Chips | |
| 12h30 | Keynote | Synopsys | |
| 14h30 | Session 3 | Infrastructure and Data Processors | |
| 16h00 | Keynote | Skydio | |
| 17h30 | Session 4 | Enabling Technologies | |
| Day 2 Aug 24th |
08h30 | Session 1 | ML Inference for the Cloud |
| 10h00 | Keynote | Department of Energy | |
| 11h30 | Session 2 | ML and Computation Platforms | |
| 14h30 | Session 3 | Graphics and Video | |
| 17h00 | Session 4 | New Technologies | |
Here’s a fast overview of the Hot Chips 2021 schedule.
Day 0: Tutorial Day
Because Hot Chips caters to each professionals and college students, the pseudo-first day of the occasion is usually an opportunity for attendees to become familiar with new subjects within the {industry}. Of late these classes have lined subjects corresponding to constructing scaleout programs, quantum computing, new networking paradigms, and safety.
| Hot Chips 33 (2021): Tutorial Day August 22nd, Sunday |
|
| AnandTech | Info |
| 08h30 – 13h00 | Machine Learning Performance |
| Hardware and software program co-optimization of the industry-standard MLPerf benchmarks, in addition to functions, efficiency traits, key challenges, and concerns for these deploying distinctive workloads | |
| 14h00 – 17h15 | Advanced Packaging |
| How superior packaging methods allow efficiency and density enhancements, protecting… | |
