Highlights of the day: Intel could increase partnership with TSMC
DIGITIMES employees
As Intel is dealing with troubles to enhance its manufacturing processes, the CPU big is now looking for exterior assist in manufacturing of a few of its processors with TSMC having a excessive likelihood to be one of many companions. Meanwhile, PCB makers Zhen Ding and AT&S now collectively provide 60% of SLP utilized in iPhones and Apple Watch, leaving about 40% shared amongst smaller suppliers. Because of the rebellion alternative of 5G, ASE has been rising its capability of FC-AiP packaging and is trying to keep on the high of the trade for the 5G sector.
TSMC EUV nodes to draw orders from Intel, sources say: Intel at its latest earnings name disclosed that its next-generation 7nm processors, together with the corporate’s first 7nm datacenter GPU design, would depend on exterior and inside course of applied sciences, sparking hypothesis about TSMC being its potential foundry companion.
Zhen Ding, AT&S lead in SLP mainboard provide for iPhones, Apple Watch: SLP (substrate-like PCBs) makers within the provide chain of Apple gadgets have ended their first wave of competitors, with Taiwan’s Zhen Ding Technology and Austria’s AT&S every absorbing 30% of orders for iPhone and Apple Watch functions, based on trade sources.
ASE ramping up FC-AiP packaging capability: ASE Technology Holding has continued committing fairness investments to construct up its FC-AiP (flip chip-antenna in bundle) packaging capability looking for to keep up its main place within the sector, based on trade sources.
