Highlights of the day: Chipmakers pushing superior applied sciences
DIGITIMES employees
TSMC’s new 5nm Plus node reportedly will be capable to enter mass manufacturing within the fourth quarter of 2020 with the method to be initially used for AMD’s next-generation CPUs, whereas Kinsus can also be seeking to increase its FCBGA and AiP packaging companies, eyeing the enterprise alternative from 5G tools. However, the coronavirus pandemic will proceed to hang-out the IT market and is anticipated to weaken demand for backend IC supplies beginning the third quarter.
TSMC to maneuver 5nm Plus course of to quantity manufacturing in 4Q20: TSMC is anticipated to kick off quantity manufacturing of chips manufactured on an enhanced model of its 5nm FinFET course of, dubbed tentatively 5nm Plus, within the fourth quarter of 2020, in keeping with sources acquainted with the matter.
Kinsus gearing as much as develop presence in FCBGA, AiP fields: Kinsus Interconnect Technology will attempt to develop its enterprise within the FCBGA and AiP packaging fields this 12 months looking for to raised money in on new enterprise alternatives arising from 5G purposes in 2020, in keeping with the IC substrate maker.
Backend materials distributors warn of demand slowdown: IC fabrication and backend supplies distributors are anticipated to face a slowdown in shipments beginning third-quarter 2020 on the earliest due primarily to impacts of the coronavirus pandemic on terminal shopper demand and recent US sanctions on Chinese tech big Huawei, in keeping with trade sources.
