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Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according to industry sources.
Greatek is engaged in building capacity for high-end bumping, wafer-level and other advanced packaging at its plant in Toufen, northern Taiwan, in order to vie for orders from first-tier chipmakers, said the sources. The addition of high-end packaging capacity will start generating revenues in the third quarter, the sources indicated.
Logic ICs remained Greatek’s target market accounting for 57.1% of the company’s revenues in 2016, followed by analog chips with 38.2%. Greatek’s revenues generated from the analog chip sector included those from the power management IC, MCU and NOR flash segments.
Greatek reported consolidated revenues of NT$10.57 billion (US$350 million) for 2016, up 10.8% on year and hitting a record high. Net profits for 2016 increased 13.3% from a year ago to NT$2.24 billion with EPS reaching NT$3.94. The company decided to distribute a cash dividend of NT$2.75 per share for the year.
Greatek posted revenues of NT$1.78 billion in the first two months of 2017, rising 11.8% on year.
In other news, Greatek has recently obtained a pull-in of backend orders from USB chip supplier Genesys Logic, which has shifted a portion of its orders placed with Taiwan IC Packaging (TICP), according to industry sources. Genesys Logic is seeing robust demand for USB Type-C (USB-C) chip solutions from the smartphone sector.
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