DDR4-3200 CL14 has at all times been the last word candy spot for efficiency for the reason that early days of DDR4 reminiscence, and G.SKILL is now bringing the legendary high-performance effectivity to the newest 32 GB high-capacity DDR4 modules. Designed for the newest HEDT platforms with quad-channel assist, the DDR4-3200 CL14-18-18-38 specification with 256 GB (32GBx8) reminiscence package capability may be seen validated within the screenshots under with the brand new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.
Pushing the Latency Limits of AMD Platforms
Optimized to extract each little bit of reminiscence efficiency out of the newest third Gen AMD Ryzen Threadripper platform, G.SKILL can be bringing the low-latency DDR4-3200 CL14-18-18-38 256 GB (32GBx8) specification to the AMD-compatible Trident Z Neo collection. In the next screenshot, this high-efficient package is validated with the newest AMD Ryzen Threadripper 3960X processor on the ASUS ROG ZENITH II EXTREME motherboard.
Under the Trident Z Neo collection, this new DDR4 reminiscence specification may even be introduced onto the AMD X570 platform in package capacities of 128 GB (32GBx4) and 64 GB (32GBx2). In the screenshot under, the DDR4-3200 CL14-18-18-38 128 GB (32GBx4) reminiscence package is validated with the AMD Ryzen 5 3600 processor and the ASUS PRIME X570-P motherboard.
Availability & XMP 2.0 Support
These high-capacity and low-latency reminiscence specs assist Intel XMP 2.Zero for straightforward overclocking and will probably be obtainable by way of G.SKILL worldwide distribution companions in Q1 2020.
