The AI chip market holds super potential – breakthroughs in FOPLP know-how to beat the RDL-first course of barrier would be the key to success.
Abstract
DIGITIMES observes that fan-out panel-level bundle (FOPLP) has not too long ago emerged as the subsequent promising superior packaging know-how, following chip-on-wafer-on-substrate (CoWoS) and fan-out wafer-level bundle (FOWLP).
FOPLP’s major benefit lies in its use of sq. glass substrates as a substitute of silicon wafers, decreasing materials waste and making it significantly appropriate for functions with bigger die areas, reminiscent of AI GPUs and application-specific built-in circuits (ASICs). However, as a result of excessive technical boundaries to producing excessive efficiency computing (HPC) chips, FOPLP is at present primarily centered on functions reminiscent of energy administration ICs (PMICs).
In addition to OSAT (outsourced semiconductor meeting and testing) corporations, panel producers reminiscent of Innolux and PCB producers reminiscent of Unimicron are additionally actively investing in FOPLP. TSMC, the worldwide semiconductor foundry chief, introduced in 2024 its intention to put money into FOPLP, elevating considerations amongst different corporations about potential market fluctuations.
