Driver-IC backend agency Chipbond Technology is about to land COF packaging orders from Apple for a LCD-based iPhone machine to be launched in 2019, permitting it to proceed having fun with brisk gross sales within the second quarter, in line with business sources.
The firm reported that its revenues expanded 21.31% on yr to NT$4.671 billion (US$151.44 million) within the first quarter of 2019. The outcomes defied the corporate’s earlier steering for an over 10% decline in revenues for the quarter.
For March alone, revenues totaled NT$1.564 billion, rising 18.42% from a yr earlier.
Chipbond is prone to function the only real driver IC backend service provider for the forthcoming LCD-based iPhone machine, which may very well be the final of its variety to be launched by Apple because the US smartphone vendor reportedly intends to launch three iPhone fashions all based mostly on OLED expertise in 2020, the sources indicated.
Apple is predicted to start out inserting orders for COF packaging at Chipbond in May-June, driving up the backend service supplier’s revenues for the second quarter, stated the sources.
Taiwan-based wafer probe card supplier MPI, which has established long-term partnership with Chipbond, will even profit from Apple’s COF orders by offering COF substrates and wafer probe playing cards to Chipbond, added the sources.
