Yangtze Memory Technologies Co. (YMTC) has introduced that it is developed its new 128-layer 1.33 Tb QLC 3D NAND reminiscence chip, the X2-6070. The new chip relies on its Xtacking structure which allows it to run with tremendous excessive I/O whereas maximising the density of its reminiscence arrays. YMTC has additionally unveiled its plan for a 128-layer 512 Gb TLC chip, the X2-9060, designed to fulfill extra numerous software necessities.
We first reported on the China-based firm YMTC getting into its 3D NAND reminiscence chips into manufacturing again in 2018, when it unveiled its Xtacking Architecture on the Flash Memory Summit. While it did not disclose technical particulars of its announcement, it did state the Xtacking structure has the potential to run the I/O with speeds of as much as 3 Gbps. Fast ahead to 2019, and it introduced that it deliberate to begin quantity manufacturing of its 64-layer 3D NAND which we additionally reported on.
Using its Xtacking structure on the forefront of manufacturing, each the brand new X2-6070 and X2-9060 function its up to date 2.zero variant which YMTC claims to deliver extra advantages to flash reminiscence. Both the X2-6070 and X2-9060 are claimed to ship as much as 1.6 Gb/s of I/O efficiency and function with a Vccg voltage of 1.2 V. YTMC has acknowledged that the X2-6070 QLC primarily based chip might be first utilized in consumer-grade SSDs, with the intention to then ship its capabilities into Enterprise centered drives.
YMTC X2-6070 128-Layer QLC 3D NAND reminiscence chip
The QLC primarily based X2-6070 has 128-layers and greater than 366 billion efficient charge-trap reminiscence cells. Each reminiscence cell has 4-bit of knowledge, which equates to 1.33 Tb of storage capability. Everything is proportionate to value, and it looks like YMTC, which is newer than most to 3D NAND stacking, may once more enhance its Xtacking structure sooner or later.
We anticipate that YMTC, who’s a part of the Tsinghua Unigroup in China, is utilizing the XMC fab in Wuhan China to provide its wafers for its 3D NAND. Tsinghua acquired XMC again in 2016, and whereas we’ve not had it confirmed, it’s more likely to be producing its wafers on the XMC fab, which is one in every of China’s largest semiconductor fabrication crops which additionally makes use of the Xtacking structure.
YMTC hasn’t launched official specs or knowledge sheets in regards to the X2-6070 QLC and X2-9060 MLC reminiscence chips, nor has it acknowledged when it’s more likely to be built-in with its controller companions (or which controllers assist it).
