The international IC packaging and testing market had a scale of US$28 billion in 2018 with the top-10 gamers commanding a mixed 84% share. Three of the top-10 gamers are based mostly in China. Of the 4 sectors in China’s semiconductor trade, packaging and testing is the one with applied sciences closest to the worldwide stage. This is as a result of Jiangsu Changjiang Electronics Technology started its acquisition technique early. Jiangsu Changjiang at the moment generates revenues of round US$3.64 billion a yr, holding a worldwide market share of 13%.
Joining Jiangsu Changjiang within the international top-10 are Tongfu Microelectronics and Tianshui Huatian Technology. The three of them commanded over 20% of the worldwide packaging and testing orders.
At the second, Taiwan gamers are nonetheless probably the most aggressive within the packaging and testing area. Taiwan-based Advanced Semiconductor Engineering (ASE), SPIL, Powertech Technology (PTI), King Yuan Electronics (KYEC) and Chipbond are all top-10 gamers. The 5 companies collectively are in a position to fulfill 44% of worldwide packaging and testing demand, and along with different Taiwan-based non-top-10 gamers resembling Orient Semiconductor Electronics and Sigurd Microelectronics, they’ve managed over half of the worldwide packaging and testing marketplace for the previous 10 years.
Taiwan gamers’ management of the back-end strategy of the semiconductor trade, plus Taiwan’s power in IC distribution, varieties a agency assist for the competitiveness of Taiwan’s IC ecosystem.
(Note: This is a part of a collection of articles by Digitimes president Colley Hwang on the newest developments of the IT trade within the wake of the US-China commerce struggle.)
