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ASE, VisEra obtain packaging orders for under-glass fin…

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ASE, VisEra obtain packaging orders for under-glass fingerprint sensors from Synaptics, says report
EDN; Jessie Shen, DIGITIMES [Friday 25 November 2016]

Taiwan-based Advanced Semiconductor Engineering (ASE) and VisEra Technologies have both landed packaging orders for under-glass fingerprint sensors from Synaptics, according to a recent Chinese-language Economic Daily News (EDN) report.

Synaptics’ under-glass fingerprint sensors will be first equipped in Samsung Electronics’ Galaxy S8 smartphones slated for launch in 2017, the report cited market sources as saying.

Earlier in 2016, Synaptics announced sampling of its new 6x6mm Natural ID FS4500 fingerprint sensor solution. The new Synaptics FS4500 solution delivers secure biometric authentication through glass or ceramic buttons, and recessed cover glass up to 300um thick. Mass production of the chip is scheduled for the fourth quarter of 2016, Synaptics said.

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Categories: Bits + chips IC design, distribution IC manufacturing

Tags: ASE fingerprint sensor packaging Synaptics

Companies: Advanced Semiconductor Engineering

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ASE, VisEra obtain packaging orders for under-glass fingerprint sensors from Synaptics, says report
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