AMD senior technical advertising and marketing supervisor Robert Hallock, responding to a selected query on Twitter, confirmed that the third technology Ryzen processors do characteristic soldered built-in heatspreaders (IHS). Soldering as an interface materials is most popular because it affords higher warmth switch between the processor die and the IHS, versus utilizing a fluid TIM reminiscent of pastes. “Matisse” shall be one of many uncommon few examples of a multi-chip module with a soldered IHS. The bundle has two sorts of dies, one or two 7 nm “Zen 2” 8-core CPU chiplets, and one 14 nm I/O Controller die.
The most comparable instance of such a processor can be Intel’s “Clarkdale,” which has CPU cores sitting on a 32 nm die, whereas the I/O management, together with reminiscence controller and iGPU, are on a separate 45 nm die. On-package QPI connects the 2. Interestingly, Intel used two totally different sub-IHS interface supplies for “Clarkdale.” While the CPU die was soldered, a fluid TIM was used for the I/O controller die. It would therefore be very attention-grabbing to see if AMD solders each sorts of dies beneath the “Matisse” IHS, or simply the CPU chiplets. Going by Hallock’s robust affirmative “Like a boss,” we lean towards the potential of all dies being soldered.
